CuCrZr合金动态再结晶行为的研究_毕业论文.doc

河南科技大学毕业设计（论文） PAGE PAGE 11 毕业设计论文 CuCrZr合金动态再结晶行为的研究 摘 要 随着集成电路芯片的高度集成化，IC向短、小、轻、薄的方向发展，电子封装也随着向高密度封装发展，引线间距减小，厚度减薄，功率增加要求引线框架材料具有更高的强度、导电性和导热性。Cu-Cr-Zr合金具有高的强度和良好的导电、导热性能及抗氧化性，可作为电阻焊电极和结晶器等材料在电工、电力及航空等行业得到广泛的应用。 本文对Cu-Cr-Zr合金的动态再结晶行为进行了研究。利用Gleeble-1500热模拟实验机对Cu-Cr-Zr合金进行高温热压缩变形，研究在变形温度为550~750℃、应变速率为0.01~5s-1工作条件下该合金的流变应力行为，探讨变形温度、应变速率与流变应力的相互关系，建立合金热变形流变应力本构方程并算出热变形激活能。实验结果表明：流变应力随变形温度的升高而减小，随应变速率的增加而增加；Cu-Cr-Zr合金的热变形激活能为845.18kJ/mol，并构建本构方程；通过显微组织分析，进而研究合金动态再结晶行为。 关键词： Cu-Cr-Zr合金，热压缩变形，变形温度，流变应力，本构方程，动态再结晶 The Study on Dynamic Recrystallization Behavior of Cu-Cr-Zr Alloy ABSTRACT With the high integration of IC chip,IC turn to be shorter,smaller,lighter, thinner and the density of electronic packaging gets higher,While the strength, electrical conductivity and thermal conductivity of lead frame material increase with the decreasing of lead spacing and thickness.Cu-Cr-Zr alloy has been widely used as a resistance welding electrode and the mold material in the electrical,electricity and aviation industries because of high strength,good electrical conductivity,thermal conductivity and oxidation resistance. Dynamic recrystallization behavior of Cu-Cr-Zr alloy was studied. The flow stress behavior of Cu-Cr-Zr alloy was studied by thermal simulation test at the deformation temperature of 550~750℃ and the strain rate of 0.01~5s-1 on the Gleeble-1500 thermal mechanical simulator. The relationship among deformation temperature,strain rate and flow stress was investigated,While The constitutive equation was established and the activation energy was calculated.The results showed that the flow stress decreased with the increasing of deformation temperature and increase with the growth of strain rate. The constitutive equation was established with the activation energy 845.18kJ/mol. Dynamic recrystallization behavior was studied by the analysis of microstructure. KER WORDS: Cu-Cr-Zr alloys, hot deformation,deformation temperature, flow stress, constitutive equation, dyn