AKRS HP LED封装工艺教材高亮度LED解决方案.ppt

* Gold Wire Bonding Solution * Encapsulation Encapsulation Molding Lens Attach Dispensing Dome shape lens Hollow lens + underfill * Molding Solution * Bottom Cavity Top Mold Top mold standby Input Indexer Lead Frame Bottom Cavity Top Mold Film sucked inside cavity Substrate indexed and ready to load Top mold moves to loading/unloading position Loading Bottom Cavity Top Mold Top mold moves up with loaded substrate Dispenser tip moves in to dispense Bottom Cavity Top Mold Top mold moves down Vacuum applied to evacuate entrapped air Vacuum 1 2 3 4 Film Compression Process Flow * Bottom Cavity Bottom Cavity Top mold moves up to separate molded strip from film Air blow is used to levitate film Film is replenished Top mold moves down to loading/unloading position Ready to unload molded strip Top mold moves to full clamped position Silicone is cured Top Mold Top Mold Output indexer unloads molded strip Top mold going to standby and ready for next cycle Air blow Film is replenished 5 6 7 8 Bottom Cavity Top Mold Bottom Cavity Top Mold Unloading Output Indexer Compression Process Flow * Molding Performance Lens molded on Cu LF Lens molded on Ni-Pd LF * Package Sorting Solution *Remark: All performance is materials and package dependent High Speed Sorter 128-Bin Collection * System Architecture V1.0 Bowl Feeder Module Precisor Contactor (Optional) Contactor Pick Arm Multi-Bin (128 Bins) High Speed Multi-Bin (18 Bins) Host PC LCD Monitor Motion Control Tester I/O sensors Motor Driver Rotary arm theta Motor Driver Rotary arm Z Motor Driver Main Turret Motor Driver Precisor Motor Driver Test Stn1 Motor Driver HS Bin Motor Driver Normal BinX Motor Driver Normal BinY CMOS Camera Spectrometer Photo Sensor * 机器结构视图 转盘部份视图 * Taping Process Overview Taping Picking package Input reel Output reel Heater block Feed direction Input reel handling system Output reel handling system Wafer inspection In-pocket inspection * High Speed Taping LED package size: 180 x 120 x 140mil3 Sa