修正阵列DPAMDPAFSEAMSEAF系列连接器.pdf

修正阵列DPAM, DPAF, SEAM, SEAF系列连接器 DP Array和SEARAY连接器 Reworking Grid Array connectors must be accomplished using hot air rework equipment. The recommended procedure is as follows: 修正阵列连接器必须用热风修正机来完成。推荐使用下列步骤： 1. From your rework equipment supplier, obtain a hot air rework nozzle specifically designed for use with the damaged connector. 从修正设备供应商购买一个用于不良连接器修正而专门设计的热风修正嘴。 2. Using a syringe or flux pen, add liquid flux to the connector solder joints allowing the flux to penetrate under the body. 用注射器或松香笔把液态松香加入到连接器锡点处并让松香渗入到胶条下的锡点处。 3. Lower the hot air rework device, set to a maximum of 250℃, down over the connector and allow the hot air to circulate and liquefy the solder joints. 修正时，降低热风修正设备并设置最高温度到250℃，让热风沿圈状吹连接器直到锡点熔化。 Note: It is important to use a bottom pre-heater to avoid open solder joints because of PCB bow and twist during the repair process. Before finalizing the rework process, a thermal profile should be performed with the thermocouples in direct contact with the insulator body and solder leads to verify the temperatures of the PCB and components. 说明：使用一个底部预热器是很重要的，这样为避免在修正过程中由于印刷线路板受热不均而翘曲变形，从 而导致锡点开路。在做最后的修正工序前，应用热电偶做出一个有直接联系的胶条和锡点引线的温度曲线， 以核对主板和组件的温度。 4. Raise the hot air nozzle and remove the connector. 待连接器端子下的锡点熔化后，抬高热风修正嘴，移出连接器端子。 5. The board must then be cleaned and the pads leveled with a solder wick mesh to make sure the pads are an even height and no bumps or raised areas remain. 修正后的主板必须被清洗并用烙铁和铜网吸带把焊盘上的多余的锡吸净，以确保焊盘等高并均匀的分布 在一个水平面上，没有留下凹凸不平。 6. Using a manual or pneumatic dispensing device, apply the solder paste to the pads. 使用手动或气动刷锡设备把锡膏刷到焊盘上。 7. Load the connector into position making sure all leads are sitting in the paste. 然后把连接器端子装入主板并确保端子引线插入锡膏里。 8. Lower the hot air device over the connector and allow the paste to liquefy for a period of 30-90 seconds. Refer to the solder manufac