max3232串口通信模块.doc

D D D D D D D D D D ± SLLS410I ? JANUARY 2000 ? REVISED JANUARY 2004 RS-232 Bus-Pin ESD Protection Exceeds ±15 kV Using Human-Body Model (HBM) D, DB, DW, OR PW PACKAGE (TOP VIEW) Meets or Exceeds the Requirements of TIA/EIA-232-F and ITU v.28 Standards Operates With 3-V to 5.5-V VCC Supply Operates Up To 250 kbit/s C1+ V+ C1? C2+ 1 2 3 4 16 15 14 13 VCC GND DOUT1 RIN1 Two Drivers and Two Receivers C2? ROUT1 5 12 Low Supply Current . . . 300 μA Typical External Capacitors . . . 4 × 0.1 μF Accepts 5-V Logic Input With 3.3-V Supply Alternative High-Speed Pin-Compatible Device (1 Mbit/s) ? SNx5C3232 Applications ? Battery-Powered Systems, PDAs, Notebooks, Laptops, Palmtop PCs, and Hand-Held Equipment V? DOUT2 RIN2 6 7 8 11 10 9 DIN1 DIN2 ROUT2 description/ordering information ORDERING INFORMATION TA PACKAGE? ORDERABLE PART NUMBER TOP-SIDE MARKING SOIC (D) Tube of 40 MAX3232CD Reel of 2500 MAX3232CDR MAX3232C ?0°C to 70°C SOIC (DW) SSOP (DB) Tube of 40 MAX3232CDW Reel of 2000 MAX3232CDWR Tube of 80 MAX3232CDB Reel of 2000 MAX3232CDBR MAX3232C MA3232C TSSOP (PW) Tube of 90 MAX3232CPW Reel of 2000 MAX3232CPWR MA3232C SOIC (D) Tube of 40 MAX3232ID Reel of 2500 MAX3232IDR MAX3232I ?40°C to 85°C SOIC (DW) SSOP (DB) Tube of 40 MAX3232IDW Reel of 2000 MAX3232IDWR Tube of 80 MAX3232IDB Reel of 2000 MAX3232IDBR MAX3232I MB3232I TSSOP (PW) Tube of 90 MAX3232IPW Reel of 2000 MAX3232IPWR MB3232I ? Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at /sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright ? 2004, Texas Instruments Incorporated POST OFFICE BOX 655303 ? DALLAS, TEXAS 75265 1 ± SLLS410I ? JANUARY 2000 ? REVISED JANUARY 2004 description/ordering informatio