半导体量测设备及应用介绍 201309.ppt

半导体量测设备及应用介绍 陈贵荣 2013/09/11 E_mail : chen.kueijun@msa.hinet.net 芯片凸块制程检验 ? 雷射扫瞄仍是目前凸块检测最广为使用的 三维量测技术 Failure Analysis_1 Failure Analysis_2 Examples of solder bump defect ? Explain 高阶封装技术 ? 300mm 晶圆 高阶封装技术 ? Wafer Bump 3D Bump Inspection using Laser Triangulation ? 3D and 2D bump inspection is a critical component in manufacturing of bumped wafers. Continuous miniaturization and use of through silicon via (TSV) in 3D packages are pushing bump sizes smaller and smaller. The small bump size, small pitch and high number of bumps are challenging inspection technologies, requiring high accuracies and high throughput. ? Laser triangulation is the dominant technology for 3D characterization of solder and pillar bumps used in conventional packaging techniques. The technology is a line scan laser with the ability to collect hundreds of 3D data points along one scan line in a fraction of a second. These data points can then be used to build a 3D model of the top of the bump and surface of the wafer for local height inspection. As bump size and pitch continue to decrease and bump numbers head towards tens of millions per wafer, the speed and accuracy of laser triangulation technology gives 3DIC manufacturers the ability to tightly control bump processes and detect bump defects. Basic Geometry of Laser Triangulation 雷射三角几何示意图 此雷射三维系统之量测精度，主要受限于 传感器之分辨 率 及 投射之雷射光线宽 ，越细的雷射线宽及高分辨率传 感器，可获得较高之量测精度。 雷射三角法系统架构图 ? 利用程控，可以调整雷射光之线宽及扫瞄速度。 ? 此系统之组成简单稳健，适合工业环境之实际应用。 Stage L a s e r M50 Object Encoder Driver M50 I/O Slit Scanner ? Slit scanners are a direction extension of the basic triangulation principle 非接触三角法探头原理 Wafer Scanner ? For both standard and flip chip wafers, the Wafer Scanner ? Inspection Series provides superior yield management for 3D/2D bump and RDL metrology, bump and RDL defect and macro defect inspection throughout post-fab processes. ? Defects created in the post-fab area between wafer processing,