PCB专业术语名词解释.pptx

;印制电路：printed circuit 印制线路：printed wiring 印制板：printed board 印制板电路：printed circuit board (pcb) 印制线路板：printed wiring board(pwb) 印制元件：printed component 印制接点：printed contact 印制板装配：printed board assembly 板：board; 10. 单面印制板：single-sided printed board(ssb) 11. 双面印制板：double-sided printed board(dsb) 12. 多层印制线路板：mulitlayer printed wiring board13. 刚性印制板：rigid printed board14. 刚性单面印制板：rigid single-sided printed board 15. 刚性双面印制板：rigid double-sided printed board17. 刚性多层印制板：rigid multilayer printed board ;;22. UL :Underwrites’ Laboratories(美国保险商实 验所);31. TCN： Temporary Change notice 临时更改通知;第二篇： 有关材料;9.基材：base material 10. 层压板：laminate 11. 覆金属箔基材：metal-clad bade material 12、 覆铜箔层压板：copper-clad laminate (ccl) 13、 单面覆铜箔层压板：single-sided copper-clad laminate 14、 双面覆铜箔层压板：double-sided copper-clad laminate 15、 复合层压板：composite laminate 16、 薄层压板：thin laminate 17、 金属芯覆铜箔层压板：metal core copper-clad laminate 18、 金属基覆铜层压板：metal base copper-clad laminate;第三篇： 有关工序;PTH;2. NPTH：;3. SMT/SMD;4. BGA/CSP: BGA---Ball Grid Array CSP--- Chip Scale package;5. Fiducial mark : 作用： 装配时作为对位的标记;6. Dummy pattern(thief pattern)：;7. 无孔测试Pad：;9. Thermal： ;;12. Gold finger：金手指;15. VIP：;Blind/Buried hole; 19. LDI;20. Heat sink:;Aspect ratio;22. AGP:;23. Mother board:;24. Memory bank:;第四篇： 检查与测试;;;; 欧盟 RoHS WEEE指令对无铅PCB要求 无铅PCB必须满足欧盟 RoHS（Restriction of the use of certain Hazardous Substances in electrical and electronic equipment）2002/95/EC指令 和《电子信息产品生产污染防治管理办法》的规定，从2006年7月开始禁用六种物质 （铅、镉、六价铬、水银、PBB（多溴化联苯）、PBDE（多溴联苯醚）。其中PCB板主要检测项目包括：PCB基材、阻焊、丝印、铜皮等。 ;If this specification conflicts with any other documents the following order of precedence shall apply: a)???????? Purchase order b)??????? Printed wiring board drawings and drill and trim documentation c)??????? This specification d)??????? Documents referred to in this speciation.? ? Supplier shall use applicable fabrication panel coupon as defined in