6[1]PCBA制程工程技术概论与基础_.pptx

伟创力校企合作项目培训; ;;;;Electronics Industry Sectors 电子工业部门 ;What is Surface Mount Technology (SMT)?什么是表面贴装技术（SMT）？ A modern form of component and assembly process technology一种现代的元件和组装工艺技术 Used by electronics industry to manufacture Printed Circuit Board (PCB) assemblies用于电子工业的印刷电路板（PCB）组装 ;Also referred to as Insertion Mount Technology 也被称为插入安装技术 Electronic components are Inserted into holes in the PCB电子元件插入到 PCB的孔里; Unavailability of odd shaped, high power, and specialized components. 奇怪形状，高功率，和一些特殊的元件不能用单一的组装技术。 More investment required to setup a full SMT process 建立一个全套的SMT制程需要更多的投资。 In many cases it is cheaper to use through hole components 插件元件在许多情况下是便宜的 THT is more robust and is necessary in certain applications 插件在某些应用中更可靠和必要;SMT and Mixed Technology Assembly Types SMT和混合组装技术类型 ;Electrical Considerations电器考量 ?PCB assembly density PCB组装密度 ?Power requirements电源需求 ?Power and signal distribution电源和信号分布 ?Input/Output requirements输入输出需要 ?Noise Crosstalk between traces, pads, layers, etc. PCB 线路之间，焊盘之间,层与层之间的杂讯 和共鸣 ?Hazardous voltage isolation 危险电压的隔绝 ?Component selection 元件的选择 Manufacturing Considerations生产的考量 ?Assembly type and component mix装配型号和元件的混合 ?Manufacturing process capability生产制程能力 ?Board material 板材料 ?Inter-package Spacing 元件脚间距 ?Land pattern design and footprint orientation 焊环图案设计和器件封装方向 ?Product volume产品量;Thermal Considerations热考量 ?Inter-package spacing元件脚间距 ?Thermal expansion mismatch热膨胀系数不匹配 ?Glass transition temperature玻璃化温度 ?Processing temperatures加工温度 ?Operating conditions工作条件 ?Thermal management requirements热管理要求 Cost considerations成本考量 PCB cost PCB 成本 Material of the PCB物料成本 Number of layers PCB 　 ＰＣＢ　层数 Trace width and space 线路宽度和空间 Via requirements 过孔要求 Special finish requirements 特殊表面处理要求 Component cost 元件成本 Assembly equipment cost 组装成本 Processing cost 工艺成本;Material Considerations物料考量 ?Material properties材料特性 ?Compatibility兼容性 ?Application requirements运用需求 ?Processing requirements工艺