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Introduction to Flexible Circuit Materials;簡報大綱;簡報大綱 (continue);軟性電路板之主要基材;Double-Sided C.C.L. .(雙面銅箔基材)
;Adhesive-Less C.C.L. .(無膠銅箔基材);Coverlay(覆蓋膜);Stiffner (補強材);;Sheet Adhesive
PhotoImageable Coverlay (PIC)
Dry Film
Fine-Line Application
Camera
Automotive
Others;Dielectric Substrates;必備之特性
Mechanical Strength
Flexibility
Dimensional Stability
Dielectric Properties
Thermal Properties
Chemical Resistance
Moisture Absorption
Cost
;Substrates 之種類
Polyimide
Polyester
Fluorocarbon
Aramid Paper
Composite;Polyimide:
Popularized by DuPont under “Kapton”
Also known as PI
First choice of film in most FPC
Infusible and flame retardant
High Tg (約 260C - 280C)
Good dimensional stability;Substrates;Substrates;Property Polyester Polyimide Fluorocarbon Aramid Paper Composite;Adhesive;Adhesive;Adhesive;Adhesive;Adhesive;Adhesive;Adhesive;Adhesive;Conductors/Foil;Conductors/Foil;Conductors/Foil;;Introduction
to
DuPont Products;DuPont Product Family;Pyralux ?;Pyralux ?;Pyralux ?;Pyralux P/N’s;Pyralux P/N’s;Teclam ?;DNC - series
UL Approved
Least Repellency
Good Peeling Strength
Excellent Heat Humidity Resistance
Excellent Transparency
Same Product Offering as FNC
;Teclam ?;Teclam ?;Q A
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