IPC-2223B柔性电路板设计标准.pdfVIP

IPC-2223B Sectional Design Standard for Flexible Printed Boards Flexible Circuits Design Subcommittee (D-11) FINAL DRAFT FOR INDUSTRY REVIEW September 2007 Published by IPC 3000 Lakeside Drive Suite 309S Bannockburn, IL 60015-1249 847/615-7100 Fax 847/615-7105 URL: (2223B)-i 1 SCOPE This standard establishes the specific requirements for the design of flexible printed circuit applications and its forms of component mounting and interconnecting structures. The flexible materials used in the structures are comprised of insulating films, reinforced and/or non-reinforced, dielectric in combination with metallic materials. These interconnecting boards may contain single, double, multilayer, or multiple conductive layers and can be comprised wholly of flex or a combination of both flex and rigid. 1.1 Purpose The requirements contained herein are intended to establish specific design details that shall be used in conjunction with IPC-2221 and may also be used in conjunction with IPC-2222 for the rigid sections of rigid-flex circuits. 1.2 Classification of Products Classification type and use of products shall be in accordance with IPC-2221 and as stated in 1.2.1 and 1.2.2. 1.2.1 Board Type Type 1 Single-sided flexible printed wiring containing one conductive layer, with or without stiffener (see Figure 1-1 and Figure 1-2) Figure 1-1 Type 1 Single-sided Flexible Printed Board – Adhesive Substrate Construction