半导体制造装备概述.ppt

Cleaning To ensure bondability and reliability of wirebond, one of the critical conditions is that the bonding surface must be free of any contaminants. Therefore cleaning is an important work before bonding. The method usually adapted is molecular cleaning method, plasma or UV-ozone cleaning method. 第六十页，共九十三页。 Bond evaluation Destructive bond pull test (Method 2011) Internal visual (Method 2010; Test condition A and B) Delay measurements (Method 3003) Nondestructive bond pull test (Method 2023) Ball bond shear test Constant acceleration (Method 2001; Test condition E) Random vibration (Method 2026) Mechanical shock (Method 2002) Stabilization bake (Method 1008) Moisture resistance (Method 1004) 第六十一页，共九十三页。 Destructive bond pull test (Method 2011) 第六十二页，共九十三页。 If both thebonds are at the same level and the hook is applied at the center, the forces can be represented When the both angles are 30o, the pull force is equal to the breakload. The failure during pull test may occur at one of the five positions in the wirebond structure: A. Lift off first bond B. Wire break at transition first bond C. Wire break mid span D. Wire break at transition second bond E. Lift off second bond When properly pulled, the bond should fail at B or D. If failures occur at A, C, or E, then the bonding parameters, metallization, bonding machine, bonding tool, hook, has to be reviewed. 第六十三页，共九十三页。 Flip-Chip Technology 第六十四页，共九十三页。 Advantages: · Smaller size: Smaller IC footprint (only about 5% of that of packaged IC e.g. quad flat pack), reduced height and weight. · Increased functionality: The use of flip chips allow an increase in the number of I/O. I/O is not limited to the perimeter of the chip as in wire bonding. An area array pad layout enables more signal, power and ground connections in less space. A flip chip can easily handle more than 400 pads. · Improved performance: Short interconnect delivers low inductance, resistance and capacitance, small electrical delays, good high f