IPC标准清单-中文英文对照版 .pdf

IPC标准清 No. 英文名称 IPC-T-50G Terms and Definition for Interconnecting and Packaging 1 Electronic Circuits 2 IPC-TM-650 Test Methods Manual IPC/EIA J-STD-001C Requirements for Soldered Electrical 3 Electronic Assemblies IPC-HDBK-001 Handbook and Guide to Supplement J-STD-001— 4 Includes Amendment 1 5 IPC-A-610D Acceptability of Electronic Assemblies IPC-HDBK-610 Handbook and Guide to IPC-A-610 (Includes IPC-A- 6 610B to C Comparison 7 IPC-EA-100-K Electronic Assembly Reference Set IPC/WHMA-A-620 Requirements and Acceptance for Cable and Wire 8 Harness Assemblies IPC/EIA J-STD-012 Implementation of Flip Chip and Chip Scale 9 Technology 10 IPC-SM-784 Guidelines for Chip-on-Board Technology Implementation IPC/EIA J-STD-026 Semiconductor Design Standard for Flip Chip 11 Applications J-STD-027 Mechanical Outline Standard for Flip Chip and Chip Size 12 Configurations IPC/EIA J-STD-028 Performance Standard for Construction of Flip 13 Chip and Chip Scale Bumps J-STD-013 Implementation of Ball Grid Array and Other High Density 14 Technology 15 IPC-7095 Design and Assembly Process Implementation for BGAs 16 IPC/EIA J-STD-032 Performance Standard for Ball Grid Array Balls 17 IPC-MC-790 Guidelines for Multichip Module Technology Utilization 18 IPC-M-108 Cleaning Guides and Handbook Manual 19 IPC-5701 Users Guide for Cleanliness of Unpopulated Printed Boards IPC-TP-1113 Circuit Board Ionic Cleanliness Measurement: What 20 Does It Tell Us? 21 IPC-CH-65A Guidelines for Cleaning of Printed Boards Assemblies 22 IPC-SC-60A Post Solder Solvent Cleaning Handbook 23 IPC-SA-61A Post Solder Semi-aqueous Cleaning Handbook 24 IPC-AC-62A Aqueous Post Solder Cleaning Handbook IPC-TR-476A Electrochemical Migration: El