J-STD-033D 潮湿、再流焊和工艺敏感器件的操作、包装、运输及使用(EC).pdf

J-STD-033D(中文版) 潮湿、再流焊和工艺敏感器件的 操作、包装、运输及使用 1 FOREWORD/前言 The advent of surface mount devices (SMDs) introduced a new class of quality and reliability concerns regarding damage such as cracks and delaminationfromthe solder reflow process.This document describesthestandardized levelsoffloor-lifeexposurefor moisture/reflow sensitive SMDs alongwiththe handling,packing and shipping requirements necessary to avoid moisture/reflow related failures. Companiondocuments J-STD-020,J-STD-075and JEP113 definethe classification procedure andthe labeling requirements,respectively. SMD 零件的出现直接带来了一类新的质量和可靠性问题，涉及回流焊过程中的 “裂纹和分层”等损 伤。本文件描述了对潮气/回流敏感的smd 的现场寿命(裸露寿命)暴露的标准化水平，以及为避 免潮气/回流相关故障所必需的处理、包装和运输要求。配套文件J-STD-020、J-STD-075和JEP113分 别定义了分类程序和标签要求。 For moisture sensitivity, moisturefromatmospheric humidity enters permeable packaging materials by diffusion.Assembly processes usedto solderSMDsto printed circuit boards (PCBs)exposethe entire package body to temperatures higherthan 200 ℃ During solder reflow, the combination of rapid moisture expansion,materials mismatch,and material interface degradationcan result incracking and/ ordelaminationof critical interfaceswithinthedevice. 对于湿度敏感器件，水气会通过包装材料渗透到包装内部，并在不同材料的表面聚结。在组装工艺中， SMD 元件贴装在 PCB 上时会经历超过200℃的高温，在焊接时因湿气的膨胀会造成一系列的焊接 品质问题。 Typicalsolder reflow processes of concernforalldevices are convection,convection/ IR, infrared (IR), vaporphase(VPR),hot airreworktools,andwavesolder, includingfull immersion. 所有器件所关注的典型回流焊工艺包括对流、对流/IR、红外 (IR)、 气相 (VPR)、 热风返工工具 和波峰焊，包括全浸焊。 Non-semiconductordevices may exhibit additional processsensitivities beyond moisturesensitivity such asthermalsensitivity,flux sensitivityorcleaning processsensitivity. 非半导体器件可表现出超过湿度敏感性的额外工艺敏感性，例如热敏感性、熔解敏感性或清洁工艺 敏感性。 1.1Purpose /目的 The purpose of this document is to provide manufacturers users with standardized methods for