波峰焊接的缺陷分析.docxVIP

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南京信息职业技术学院

毕业设计论文

作者朱亮亮学号21621P21

系部机电学院

专业电子制造技术与设备

题目波峰焊接的缺陷分析

指导教师赵雄明曹雁

评阅教师

完成时间：2019年4月27日

毕业设计(论文)中文摘要

(题目)：波峰焊接的缺陷分析

摘要：本文详尽列出波峰焊的缺陷工艺，包括几大常见缺陷现象，虚焊、不润湿及反润湿、空洞、气泡或针孔、暗色焊点或颗粒状焊点、焊点拉尖和冷焊等，逐一列出各大现象的出现原因和对应采取的改善方法，体现在机器上的严格控制，操作人员的技术要求，来料方面的改变和硬性要求，操作人员按照方法，监督波峰焊的每一环节和对每一块PCB的不良，也论述了波峰焊的缺陷分析和改良策略，知晓波峰焊的前景发展，即通孔插装技术向表面贴装焊接的过渡和如今正在经历的无铅焊接，无铅焊接是大势所趋，而波峰焊发展在工艺与方法上的革新，也同时推动了SMT的发展。

关键词：冷焊、润湿、焊点拉尖

毕业设计(论文)外文摘要

Title：Defectanalysisofwavesoldering

Abstract:This?article?detailed?list?the?defects?of?wave?soldering?process,?including?several?common?defect?phenomenon,?virtual?welding,?wetting?and?wetting,?hollow,?bubble?or?pinhole,?dark?spot?or?granular?solder?joints,?solder?joints,?pointed?and?cold?welding?and?so?on,?enumerate?all?the?major?cause?of?the?emergence?of?the?phenomenon?and?the?corresponding?improvement?methods,?embodied?in?the?strict?control?of?machine,?operating?personnels?technical?requirements,?material?changes?and?rigid?requirements,?operators?according?to?the?method,?supervise?every?link?of?wave?soldering?and?bad?for?each?piece?of?PCB,?wave?soldering?defect?analysis?and?improvement?strategies?are?discussed,?that?the?future?development?of?wave?soldering,?That?is,?the?transition?from?through-hole?interpolation?technology?to?surface?mount?welding?and?the?lead-free?welding?that?is?being?experienced?now?are?the?general?trend,?while?the?innovation?in?process?and?method?of?wave?soldering?also?promotes?the?development?of?SMT.

Keywords:coldwelding、wetting、solderprojection

目录

1引言5

2波峰焊接的局限性5

3波峰焊的原因分析和改善对策6

3.1虚焊6

3.2不润湿及反润湿7

3.3空洞8

3.4气泡或针孔9

3.5暗色焊点或颗粒状焊点10

3.6桥连和钎焊瘤11

3.7焊点拉尖12

3.8冷焊13

4波峰焊的发展13

4.1波峰焊接类型：单波峰焊接和双波峰焊接13

4.2波峰焊的发展与前景13