PTH与电镀铜知识讲座.pptVIP

PTH与电镀铜知识讲座;一、PTH作用;二、流程介紹;三、藥水介紹;1.清潔整孔劑:CT-281;整孔作用為確保孔壁帶正電性;;2.微蝕SPS;3.酸洗;4.預浸作用;預浸劑:PED–104;5.活化劑作用（觸媒）;＊基本反應原理:

Pd2++Sn2+→Pd0+Sn4+

存在方式:

PdCl2+SnCl2→PdSnCl4(中間態)

Pd7SnCl16→Pd6Cl12+SnCl2+PdCl2

PdSnCl4+6PdCl2→Pd7SnCl16

解離反應:(活化劑中加入大量水份時)

Sn2++2H2O→Sn(OH)2(S)+2H+

Sn2++Cl-+H2O→Sn(OH)Cl(S)+H+

;活化Activation;活化劑AT–105–3;6.速化作用:;速化劑AL–106;7.化學銅:ELC-912;;＊反應式:

主反應:

Cu2++2HCHO+4OH-→Cu+H2+H20+2HCOO-

副反應:

1.2HCHO+4OH-→2COO-+2H2O+H2+2e-

2.2HCHO+NaOH→2HCOONa+CH3OH

3.CO2+2OH-→CO32-+H2O

4.2Cu2++HCHO+5OH-→Cu2O+HCOO-+3H20

5.Cu2O+H2O→Cu+2Cu2++2OH-

6.Cu2O+2HCHO+OH-→2Cu+HCOO-+H2O+H2

＊坎式效應(CannizzaroReaction):

2HCHO+OH-→CH3OH+HCOO-

;液的保養;電鍍銅;銅電鍍流程;酸性硫酸銅槽條件控制;均勻度（膜厚分佈）改善要點;穿孔力（Throwingpower）提高要點