cob与csp的制造流程.pdf

cob与csp的制造流程

英文回答：

ThemanufacturingprocessesofCOB(Chip-on-Board)and

CSP(ChipScalePackage)involveseveralstepstoproduce

integratedcircuits.Letmeexplaineachprocessindetail.

COBmanufacturingprocess:

1.Diepreparation:Thefirststepistopreparethe

semiconductordies,whicharetheindividualchipsthat

containtheintegratedcircuits.Thesediesareusually

madefromsiliconwafersandarecutintoindividualpieces.

2.Diebonding:Thenextstepistobondthediesonto

asubstrate.Thesubstrateistypicallyaceramicor

organicmaterialthatprovidessupportandelectrical

connectionsforthedies.Thediesareplacedontothe

substrateusingaspecializedadhesivematerial.

3.Wirebonding:Afterthediesarebonded,wire

bondingisperformedtocreateelectricalconnections

betweenthediesandthesubstrate.Thinwiresmadeofgold

oraluminumareusedtoconnectthebondpadsonthedies

tothecorrespondingpadsonthesubstrate.

4.Encapsulation:Oncethewirebondingiscomplete,

thediesandwirebondsareencapsulatedwithaprotective

material.Thismaterialisusuallyanepoxyresinthat

providesmechanicalprotectionandinsulationforthe

integratedcircuits.

5.Testing:Afterencapsulation,theCOBmodules

undergotestingtoensurethattheintegratedcircuitsare

functioningcorrectly.Thistestinginvolveselectricaland

functionalteststoverifytheperformanceofthechips.

CSPmanufacturingprocess:

1.Diepreparation:SimilartoCOB,thefirststepin

CSPmanufacturingisdiepreparation.Thesemiconductor

diesarepreparedfromsiliconwafersandcutinto

individualchips.

2.Redistributionlayer(RDL)formation:InCSP,a

redistributionlayerisaddedtothedietoredistribute

theinput/output(I/O)connections.Thislayerisusually

madeofathinfilmofmetalsuchascopper,anditallows

foramorecompactand