Danfoss丹佛斯Semikron Danfoss Application Note Thermal resistances of IGBT Modules EN Rev-01 应用指南.pdf

ApplicationNoteRevision:01

AN1404Issuedate:2014-11-30

Preparedby:Dr.A.Wintrich

Approvedby:P.Beckedahl

Keyword:Thermalresistance,Measurement,Datasheet,IGBT-

Module

ThermalresistanceofIGBTModules-

specificationandmodelling

1.Introduction1

2.MethodsforDeterminingThermalResistances2

2.1DefinitionswithRegardstothisApplicationNote2

2.2ChipT,CaseTandHeatsinkTemperatureTMeasurement2

jcs

2.3SpecificationofThermalResistance3

2.4MultiChipDevices4

2.5ThermalCouplingBetweenSwitches5

2.5.1Rth(j-c)6

2.5.2Rth(j-s)6

2.5.3Rth(c-s)withThermalCouplingofSwitches7

2.5.4Rth(c-s)WithoutThermalCoupling9

2.6Rth(c-s)perSwitchasaFunctionofChipSize9

2.7EffectsofMountingConditionsonRth(j-s)andRth(c-s)10

3.ModellingwithThermalEquivalentCircuits10

4.Today’sandFutureDataSheetSpecificationofRthValuesforSEMIKRONProducts11

4.1HeatsinkRatedModule12

4.2CaseRatedModules12

5.Conclusions12

1.Introduction

ForselectingasuitableIGBTmoduleitisessentialtoknowitsthermalperformanceinconjunctiontothe

thermalpropertiesofthecoolingsystemandtherequirementsgivenbytheapplication(power,ambient

temperatures,loadcycles