PCB外层线路干膜PFMEA分析范例.xlsVIP

19外层线路

变更履历（外层线路）

封面

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无none

保存期限:永久保存必威体育精装版版本storagelife：storagethelatestversionforever

开短路open/short

操作不当unproperhandling

曝光不良poorexposure

线幼tracewidthreduce

每周测量一次含尘量measuretheparticlecontenteveryweek

目视自检self-checkbyvisual

自检self-check

贴膜不牢looselamination

掩膜孔破tentingbroken

板面清洁：用粘尘机清洁板面垃圾surfacecleaning:cleanrubbishremainedonsurfacewithstickymachine

清洁不净unadequateclean

未按要求更换粘尘纸notreplacethestickypaperaccordingtorequirement

贴膜:在一定温度压力下将干膜贴附在经清洁粗化后的板面上lamination:coatthedryfimontothecleanandroughsurfaceincertaintemperatureandpressure

环境湿度过低environmenthumidityistoolow

每2H检查一次checkevery2hours

环境温度过低environmenttemperatureistoolow

贴膜温度太低laminationtemperatureistoolow

贴膜温度控制为90-120℃controllaminatetemperaturewithin90-120℃

干膜过期dryfilmisexpired

按WI指示要求的干膜有效期内使用usethedryfilmwhichisinitseffectivedateasWIrequired

更换干膜时检查有效期checktheexpireddateofdryfilmbeforereplace

贴膜压力太小laminationpressureistoolow

贴膜:在一定温度压力下将干膜贴附在经清洁粗化后的铜面上lamination:coatthedryfimontothecleanandroughcoppersurfaceincertaintemperatureandpressure

基材表面清理不够,有氧化层或油污unadequatecleanonbasematerialsurface,oxideorgreasydirtremain

水膜试验,能否形成均匀水膜waterbreaktesting

每LOT板挂时间标示牌hangtimelabelforeverylot

干膜与基板铜面表面之间出现气泡,杂物airinclusionandsundriesbetweendryfilmandcoppersurface

贴膜温度过高抗蚀剂急剧挥发laminationtemperatureistoohighandcausetheanti-etchingagentvolatiletoomuch

工艺要求的贴膜温度controlthelaminationtemperatureaccordingtorequirement

热压辊调节压力不当(过小)pressureofhotpressrollerisunproper

适当调整两辊之间的压力adjustthepressurebetweentherollers

无尘室含尘量超标particlecontentincleanroomisoutofcontrolspec.

含尘量小于1万级particlelevelislessthan10,000

粘尘纸没有更换notreplacethestickypaper

每100pnl对粘尘纸进行替换replacethestickypaperevery100panels

基板表面不平basematerialsurfaceisnotlevel

检查板的表面质量,不得有划伤凹坑checkboardsurface,noallowanceofscratchanddent

贴膜过度overlamination

干膜抗蚀剂过度挥发overvolatiliza