MITSUBISHI ELECTRIC三菱电机全 混合碳化硅功率模块 全碳化硅IPMIndustrial Full SiC Power Modules应用说明(英语).pdf

MITSUBISHI

ELECTRIC

Index

1Introductiomm.te3

1.1，FeaturesofIndustrialFullSiCPowerModules3

二_Structure4

1.3，Configurationofthepartnumber5

1.4，Lineup5

1.5，FeaturesoftheSiC-SBD6

二出”Forwardcharacteristics6

1.5.2.，Switchingcharacteristics6

1.6，FeaturesoftheSiC-MOSFET了

中On-voltagecharacteristicSs47

2.1.Common

2.2，MaximumRatings

2.3，Temperatureratings

2.4，Thermalratingsandcharacteristics10

2.5，”Electriccharacteristic11

2.6，Short-circuitcurrentlimitingcircuit(RTCcircuitb)11

3.ProductLabelInformation.se12

3.1，Labelprintingexample12

3.2，Lotnumberconfiguration12

3.3，Two-dimensionalbarcodeconfiguration12

4.，Controlcircuitdesign.ee13

4.1，Selectionofgateresistance13

4.2，Settingofgatevoltage14

4.3，Gatedrivepowersupply16

4.4，Deadtimesetting16

4.5.，Carrierfrequency17

4.6.，Gatedriver17

5，Short-circuitcurrentlimitingcircuit(RTCcircuit)ee18

5.1，ProductsequippedwithRTCcircuit18

5.2，”Principleofoperation18

5.3，Usage20

5.4，Howtocalculatetheshortcircuitdetectiondelaytime21

1MITSUBISHIELECTRICCORPORATION

FullSiCPowerModule

IndustrialFullSiCPowerModuleApplicationNote

6，Currentsensefunction.seeeeeeeeoeeeeeeeeeeoeeeeeeeeoseseeeeeeooeseseeseoeoosoeseseeseoas22

6.1，Howtousethesenseterminal22

6.2，Howtomanagewhennotusingthesenseterminal22

7，Powermoduleimplementation.seeseeseesessessnssnssnssnssnssnssnsnsnsensensonsonsentossnssossossossnns23

7.1，SystemLayout23

7.2，Methodofattachingthemoduletotheheatsink24

7.3，Thermallyconductive(heatdissipating)greaseapplicationexample.ee25

了.4，Installationtothemainterminal26

7.5，Mountingtocontrolterminal27

7.5.1，”Connectortype..

7.5.2.Solder-pintype..

7.6，Conceptofthe