曝光原理与曝光机.ppt

11/50散光型反射燈罩焦點散漫,UV均勻分佈,強度較弱11/50多層板MultilayerPCB結構通孔ThroughHole添加标题傳統多層板添加标题增層法多層板添加标题孔徑添加标题孔環AnnularRing添加标题絕緣介質層Dielectric添加标题線路添加标题線距添加标题線寬添加标题內層2添加标题內層1添加标题11/50結構術語及尺寸單位導通孔ViaHole目的:連接各層電路孔徑Ex.機鑽通孔0.35mmEx.雷射盲孔6mil孔環AnnularRingEx.單邊+5mil縱橫比AspectRatio板厚/孔徑鑽孔,電鍍能力孔間距100mil=2.54mm50mil=1.27mm線路Power/Ground層信號層Signallayer線路Conductor焊墊Pad線寬/線距(L/S)LineWidth/LineSpace6/6=150/150?m5/5=125/125?m4/4=100/100?m孔間(100mil)過几條導線8/8→過2條6/6→過3條5/5→過4條11/50外形術語及尺寸單位多層板Multi-layer層數layercount:Cu層數內層innerlayerEx.L2/L3,L4/L5外層outerlayer零件面ComponentsideEx.L1銲錫面SoldersideEx.L6外尺寸長度寬度Ex.20x16板厚Ex.63mil(條)=1.6mm尺寸單位英吋inch1inch=1000mil =25.4mm英絲mil1mil=0.001inch =0.0254mm =25.4?m5mil=0.005inch =0.125mm =125?m1mm=39.37mil11/50疊板結構例：4L疊板L1-1oz:1.4mil1080:2.5mil7628:7.0milL2/L3- 1.0mm,1/1:40mil7628:7.0mil1080:2.5milL4-1oz,1.4milTotal=61.8mil=1.569mm例：6L疊板L1-1/2oz:0.7mil1080:2.5mil7628:7.0milL2/L3- 0.38mm,1/1:17.8mil2116:4.0mil2116:4.0milL4/L5- 0.38mm,1/1:17.8mil7628:7.0mil1080:2.5milL6-1/2oz,0.7milTotal=64mil=1.6mm11/50多層板製程示意11/50裁板銅箔基板磨邊導角內層剝膜內層蝕刻內層顯像內層曝光乾膜貼合前處理內層AOI疊板壓合黑/棕氧化鍍一次銅化學鍍銅除膠渣去毛邊鑽孔乾膜貼合鍍二次銅前處理外層曝光外層顯像鍍錫鉛外層剝膜外層蝕刻噴錫鍍鎳金文字印刷文字烘烤塞孔印刷防焊後烤綠漆顯像防焊預烤防焊塗佈前處理防焊曝光成品檢查斜邊成型真空包裝成品清洗V-Cut電測剝錫鉛外層AOI典型多層板製程

Multi-LayerProcess基板處理內層製程壓合鑽孔鍍銅外層製程防焊製程表面處理檢驗成型11/50曝光製程

*/50印刷電路板影像移轉製程將PCB設計圖像(Pattern)的工程資料由CAD/CAM上轉移至網板或底片上使用印刷或曝光方式將底片上影像移轉至阻劑上再經由蝕刻、電鍍或單純顯像方式製作線路或遮蓋部分板面影像移轉ImageTransfer內層InnerLayerPrimaryImage外層OuterLayerPrimaryImage防焊SolderMask選擇性鍍金SecondaryImageTransfer曝光製程11/50曝光製程-內層光阻在線路製作製程 中使用，蝕刻完成後除去內層PrintandEtch光阻抗酸性蝕刻光阻塗佈