IoT平台间兼容性-Overview_chapter_2017.pdf

TowardsMulti-layerInteroperability

ofHeterogeneousIoTPlatforms:

TheINTER-IoTApproach

GiancarloFortino,ClaudioSavaglio,CarlosE.Palau,

JaraSuarezdePuga,MariaGhanza,MarcinPaprzycki,

MiguelMontesinos,AntonioLiottaandMiguelLlop

AbstractOpeninteroperabilitydeliversonthepromiseofenablingvendorsand

developerstointeractandinteroperate,withoutinterferingwithanyone’sabilityto

competebydeliveringasuperiorproductandexperience.IntheabsenceofglobalIoT

standards,theINTER-IoTvoluntaryapproachwillsupportandmakeiteasyforany

IoTstakeholdertodesignopenIoTdevices,smartobjects,services,andcomplexsys-

temsandgetthemtobeoperativeandinterconnectedquickly,thuscreatingnewIoT

interoperableecosystemsbyusingabottom-upapproach.Inparticular,INTER-IoT

G.Fortino()·C.Savaglio

B

DIMES-UniversityofCalabria,ViaP.Bucci,87036Rende(CS),Italy

e-mail:g.fortino@unical.it

C.Savaglio

e-mail:csavaglio@dimes.unical.it

C.E.Palau·J.S.dePuga

DCOM–UniversitatPolitecnicadeValencia,CaminodeVeraS/N,

46022Valencia,Spain

e-mail:cpalau@dcom.upv.es

J.S.dePuga

e-mail:jasuade@dcom.upv.es

M.Ghanza·M.Paprzycki

SystemsResearchInstitute,PolishAcademyofSciences,ul.Newelska6,

01-447Warsaw,Poland

e-mail:mganzha@dcom.upv.es

M.Paprzycki

e-mail:marcin@dcom.upv.es

M.Montesinos

PRODEVELOP,PlaÇadeJoandeVilarasa,14-5,46001Valencia,Spain

e-mail:mmontesinos@prodevelop.es

A.Liotta

TechnischeUniversiteitEindhoven,P.O.Box513,5600MBEindhoven,

TheNetherlands

e-mail:aliotta@tue.nl

M.Llop

AvingudaMolldelTurias/n,46024Valencia,Spain

e-mail:MLlop@

©SpringerInternationalPublishingAG2018199

R.Gravinaetal.(eds.),Integration,Interconnection,andInteroperability

ofIoTSystems,InternetofThings,DOI10.1007/978-3-319-61300-0_10