- 1、本文档共7页,可阅读全部内容。
- 2、有哪些信誉好的足球投注网站(book118)网站文档一经付费(服务费),不意味着购买了该文档的版权,仅供个人/单位学习、研究之用,不得用于商业用途,未经授权,严禁复制、发行、汇编、翻译或者网络传播等,侵权必究。
- 3、本站所有内容均由合作方或网友上传,本站不对文档的完整性、权威性及其观点立场正确性做任何保证或承诺!文档内容仅供研究参考,付费前请自行鉴别。如您付费,意味着您自己接受本站规则且自行承担风险,本站不退款、不进行额外附加服务;查看《如何避免下载的几个坑》。如果您已付费下载过本站文档,您可以点击 这里二次下载。
- 4、如文档侵犯商业秘密、侵犯著作权、侵犯人身权等,请点击“版权申诉”(推荐),也可以打举报电话:400-050-0827(电话支持时间:9:00-18:30)。
- 5、该文档为VIP文档,如果想要下载,成为VIP会员后,下载免费。
- 6、成为VIP后,下载本文档将扣除1次下载权益。下载后,不支持退款、换文档。如有疑问请联系我们。
- 7、成为VIP后,您将拥有八大权益,权益包括:VIP文档下载权益、阅读免打扰、文档格式转换、高级专利检索、专属身份标志、高级客服、多端互通、版权登记。
- 8、VIP文档为合作方或网友上传,每下载1次, 网站将根据用户上传文档的质量评分、类型等,对文档贡献者给予高额补贴、流量扶持。如果你也想贡献VIP文档。上传文档
pcb制板工艺流程8个步骤
英文回答:
PCBFabricationProcess:8EssentialSteps.
PCBfabrication,alsoknownasPCBmanufacturing,isa
complexandspecializedprocessthatinvolvesseveral
preciseandintricatestepstoproduceprintedcircuit
boards(PCBs).Theseboardsserveasthefoundationfor
electronicdevices,providingelectricalconnectivityand
supportforvariouscomponents.Hereisanoverviewofthe
eightessentialstepsinvolvedinPCBfabrication:
1.DesignandEngineering(DE)。
Theprocessbeginswiththedesignandengineering
phase,whereengineerscreatetheinitialschematicsand
layoutforthePCB.Theydeterminetheboardssize,shape,
componentplacement,androutingofelectricaltraces.The
designmustadheretoindustrystandardsandspecifications
toensureproperfunctionalityandreliability.
2.ArtworkGeneration.
Oncethedesigniscomplete,itisconvertedinto
digitalartworkfiles,typicallyinGerberformat.These
filescontaindetailedinformationabouttheboardslayout,
includingthecoppertraces,soldermask,andother
features.Theartworkfilesareessentialforguidingthe
subsequentfabricationprocesses.
3.PhotoresistApplication.
Thenextstepinvolvesapplyingaphotoresist,alight-
sensitivematerial,tothebarecoppersurfaceofthePCB.
Thisphotoresistwillbeexposedtoultraviolet(UV)light
insubsequentsteps,selectivelyhardeningitintheareas
wherecoppertracesaredesired.
4.UVExposure.
Thephotoresist-coatedPCBisthenexposedtoUVlight
throughamaskcontainingthedesiredcircuitpattern.The
UVlightselectivelyhardenstheexposedareasofthe
photoresist,creatingaprotectivelayeroverthecopper
traces.
5.Development.
TheexposedPCBisthensubjectedtoadevelopment
process,whichinvolvesimmersingitinachemicalsolution.
Thissolutiondissolvestheunexposedphotoresist,leaving
behind
文档评论(0)